光电子技术, 2013, 33 (4): 285, 网络出版: 2014-01-16
大功率LED封装的散热分析
Thermal Analysis on High-power Light-emitting Diode Package
摘要
建立大功率LED的三维封装模型, 利用有限元方法对LED的温度场分布进行模拟计算, 通过改变LED封装的相关参数, 分析得到了键合材料和基板厚度等对LED封装散热的影响, 这一设计方法对优化LED的封装具有一定的指导意义。
Abstract
A three-dimensional model of high power LED, simulated temperature distribution of LED with finite element method is established. With changing related parameters of LED packaging, the influence of bonding materials and substrate on the cooling of LED packaging was analyzed and made clear, This model can be used to optimize LED packaging.
陆建华, 朱金荣, 尹志威, 易峰, 唐开远, 倪晓武. 大功率LED封装的散热分析[J]. 光电子技术, 2013, 33(4): 285. Lu Jianhua, Zhu Jinrong, Yin Zhiwei, Yi Feng, Tang Kaiyuan, Ni Xiaowu. Thermal Analysis on High-power Light-emitting Diode Package[J]. Optoelectronic Technology, 2013, 33(4): 285.
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