用不同能量密度的飞秒激光在不同辅助气压下对TiC陶瓷进行微孔加工，采用扫描电子显微镜（SEM）、微米X射线三维成像仪(Micro-CT)和X射线光电子能谱（XPS）对微孔的形貌和化学键进行了研究。结果表明，在不同能量密度下，微孔入口圆度均不小于99%，微孔出口圆度随能量密度的增加而增大，随后趋于稳定，最大出口圆度为95%。微孔锥度随辅助气压增大而增大，当能量密度为0.51 J/mm2、辅助气压为0.3 MPa时，微孔锥度最佳，其长轴锥度为-0.13°，短轴锥度为0.77°。激光加工过程中，C-C键、Ti-C键断裂，在微孔附近形成包含金属Ti、Ti2O3和TiO2等物质的残渣。最后对激光与材料的作用机制进行了探讨。

Drilling micro-holes in TiC ceramic with femtosecond laser in different laser fluence and assisted gas pressure has been demonstrated. Scanning electron microscope (SEM), micrometer X-ray 3D imaging system (Micro-CT) and X-ray photoelectron spectroscopy (XPS) are used to investigate the morphology and chemical bonds of micro-holes. The results show that the circularities of micro-holes at the entry are not less than 99% when the laser fluence varies. The circularities of micro-holes at the exit increase as the laser fluence grows, then it tend to be stable. The maximum value of the circularity at the exit is 95%. The taper of micro-holes increases with the assisted gas pressure. When the laser fluence is 0.51 J/mm2, the taper of micro-holes drilled with 0.3 MPa gas pressure is the best, its long axis taper is -0.13° and the short axis taper is 0.77°. C-C bonds and Ti-C bonds rupture while debris which contains metal Ti、Ti2O3 and TiO2 forms around the micro-holes during laser drilling. Lastly, the mechanism of interactions between laser beam and materials is discussed.