为解决LED集成芯片光源的散热问题, 提出一种整体式热管散热器, 并在不同的热源功率、充液率、倾角下进行了自然对流散热实验研究。结果表明: 散热器的热管最佳充液率为30%。热功率较小时, 0°～50°倾角对热管传热影响不大; 倾角达到75°时, 各功率下的热管传热及散热器热阻都明显恶化。散热器启动时间约为30 min, 且几乎不受功率大小影响; 但75°倾角下, 需要更多时间达到稳定。相比于常见的平行板和太阳花翅片散热器, 采用整体式热管散热器散热的芯片结温可得到更有效控制。

In order to solve the problem of cooling LED multi-chip LED module, an integrated heat pipe heat sink was designed and fabricated. Heat dissipation experiments were conducted to study effects on heat load, filling ratio and inclination angle on the thermal performance of the heat sink in nature convection. The results show that the efficient heat transfer of the heat pipe can reduce the thermal resistance of the heat sink effectively and the optimum filling ratio is 30% in this research. Inclination angle in the range of 0°－50° has little effect on heat transfer capability of heat pipe at lower heat load. When the angle reaches 75°, heat transfer of heat pipe and thermal resistance of heat sink are all subject to a significant deterioration. The time heat sink enters stable state is about 30 min and is not affected by the magnitude of the power. However, the heat sink works stably after 40 min when angle is 75°. Compared to traditional parallel plate fins and sunflower fins heat sink, the chip junction temperature with integrated heat pipe heat sink is smallest.