应用激光, 2014, 34 (6): 557, 网络出版: 2015-01-13  

水射流对于激光刻蚀晶体硅影响的试验研究

Experimental Study about Effect of Water-Jet to Laser Etching of Crystal Silicon
作者单位
1 安徽建筑大学 激光先进制造技术研究中心,安徽 合肥 230022
2 南京理工大学,江苏 南京 210094
摘要
对比研究硅晶体激光直接刻蚀与水射流辅助激光复合刻蚀表面形貌,发现水射流与激光复合刻蚀能够有效去除重铸层并减少裂纹缺陷。研究了水射流流量对刻蚀微观形貌及刻槽深度的影响,结果表明,适当提高水射流的流速有利于改善刻蚀槽体的质量,同时水射流流速在一定程度上会影响到槽体深度,使槽体深度随着流速的提高出现先降后升的规律。最后对水射流的入射角与槽体截面形状关系进行了初步探讨性研究。
Abstract
Compare and study the surface morphology of crystal silicon processed by laser direct etching and water jet assisted laser etching, the results show that water jet and laser combined etching can remove the recast layer better, and reduce crack defects. Study the effects of water jet’s flow to etching morphology and groove depth, the results show that higher flow rate of jet is better to improve the quality of the groove body, while the flow rate of the water jet will affect the depth of groove in some extent, with the increasing of flow rate, the depth of groove up first and then down. Some preliminary and exploratory researches about the relationship between incident angle of jet and the cross-sectional shape of groove are presented in the last.

张崇天, 袁根福, 陈雪辉, 张程, 王海云. 水射流对于激光刻蚀晶体硅影响的试验研究[J]. 应用激光, 2014, 34(6): 557. Zhang Chongtian, Yuan Genfu, Chen Xuehui, Zhang Cheng, Wang Haiyun. Experimental Study about Effect of Water-Jet to Laser Etching of Crystal Silicon[J]. APPLIED LASER, 2014, 34(6): 557.

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