A simple and repeatable method to fabricate high-aspect-ratio (HAR) and high-quality microgrooves in silica is reported. The method consists of two steps: (1) formation of laser-modified regions by femtosecond Bessel beam irradiation, and (2) removing laser-modified regions through HF etching. Uniform, straight microgrooves can be fabricated and the highest aspect ratio that can be reached is ～52. The phenomenon is attributed to the uniform energy distribution in the long propagation distance, which leads to the long and uniform laser-modified regions and subsequent HF acid etching of laser-modified regions with high selectivity. This method will have potential applications in fabrication of HAR microgrooves in transparent materials.