光学技术, 2015, 41 (3): 261, 网络出版: 2015-05-20
特殊IC板引脚焊点缺陷检测中景深的研究
Research on the depth of field of soldering defect inspection for special integrated circuit units board
摘要
检测具有特殊空间结构的IC板引脚焊点缺陷时, 相机镜头相对于引脚平面会有一定的倾斜角度, 在特定的范围内获取图像清晰, 超过此范围图像出现离焦模糊。针对此问题进行了研究, 建立了景深的数学模型, 推导出合理拍摄角度的公式, 并通过实验进行了分析和验证。
Abstract
Solder joint defects detection for circuit boards with special elevated electronic units, vision camera has to be placed at certain angle in order to get clear view of the board, but image gets blurred if the camera angle exceeds specific range. Aiming at the problem a mathematical model for depth of field is proposed and an image acquisition angle is found for best results. The method and results are verified through experiment.
许增朴, 王鑫, 王永强, 周聪玲. 特殊IC板引脚焊点缺陷检测中景深的研究[J]. 光学技术, 2015, 41(3): 261. XU Zengpu, WANG Xin, WANG Yongqiang, ZHOU Congling. Research on the depth of field of soldering defect inspection for special integrated circuit units board[J]. Optical Technique, 2015, 41(3): 261.