光学学报, 2015, 35 (11): 1113004, 网络出版: 2015-11-12
温度不敏感聚合物波导微环光学生化传感器研究
Temperature Insensitive Optical Biosensor Based on Polymer Waveguide Microring
集成光学 聚合物波导 微环 光学生化传感器 温度敏感性 integrated optics polymer waveguide microring optical biosensor temperature sensitivity
摘要
温度敏感性是影响波导微环光学生化传感器性能的重要因素。从微环谐振方程出发分析了微环传感器温度敏感性产生的机理,研究了以SU8-NOA61-SU8 三明治结构聚合物衬底代替传统硅衬底,利用衬底的热膨胀效应抵消波导的热光效应,来消除聚合物波导微环光学生化传感器的温度敏感性。采用ANSYS软件对三明治衬底的厚度进行了仿真设计,得到了温度不敏感条件下的衬底厚度参数。对SU8 和NOA61 旋涂成膜工艺进行了实验研究,得到SU8和NOA61的膜厚控制精度分别为0.07 μm@20 r/min 和0.34 μm@20 r/min。分析得到三明治聚合物衬底波导微环传感器的温度敏感性和探测极限值,达到了带有温控装置的硅衬底聚合物波导微环传感器的性能。
Abstract
The temperature sensitivity is the key factor to influence the performance of optical biosensor based on waveguide microring. According the resonant equation of the waveguide microring, the mechanism inducing the temperature sensitivity is analyzed. The sandwich polymer substrate of SU8-NOA61-SU8 is employed to replace the conventional silicon substrate. The thermo- optic effect of the waveguide is counteracted by the thermoexpansion effect of the sandwich polymer substrate, resulting in the temperature insensitivity of the all polymer waveguide microring biosensor. The optimized thicknesses of the sandwich substrate for the temperature insensitive microring sensor are obtained by the design with ANSYS software. The films of SU8 and NOA61 are prepared with the spin coating technique. The controllable thickness precisions of SU8 and NOA61 films are 0.07μm@20r/min and 0.34μm@20r/min, respectively. The temperature sensitivity and the detection limit of the polymer waveguide microring biosensor with the sandwich polymer substrate are as same as the performance of the one on the silicon substrate with a temperature controller.
韩秀友, 韩笑男, 王志灵, 邵宇辰, 武震林, 任军, 王锦艳, 滕婕, 赵明山. 温度不敏感聚合物波导微环光学生化传感器研究[J]. 光学学报, 2015, 35(11): 1113004. Han Xiuyou, Han Xiaonan, Wang Zhiling, Shao Yuchen, Wu Zhenlin, Ren Jun, Wang Jinyan, Teng Jie, Zhao Mingshan. Temperature Insensitive Optical Biosensor Based on Polymer Waveguide Microring[J]. Acta Optica Sinica, 2015, 35(11): 1113004.