利用节流的高压冷却介质在微蒸发腔内相变吸热，设计了一种用于大功率激光二极管制冷的封装组件。该组件采用高热导的无氧铜，用精密线切割、化学腐蚀等技术制作微蒸发腔，再通过自制的焊接设备完成制冷组件的封装。按照大功率激光二极管条的发热模型，理论上对微蒸发腔制冷组件的温度分布进行了数值模拟，结果与60 W激光二极管条的散热实验符合较好，得到制冷剂流量为23 mL/min时的热阻为0.289 ℃/W。

Based on the theory of phase change decalescence of throttled cooling medium with high pressure in the micro evaporation cavity,a new pack module was designed for the refrigeration of high power laser diode. Oxygen-free copper with high heat-conducting was adopted in the module. The micro evaporative cooling module was constructed with the process of wire-electrode cutting,chemical corrosion,and welding by the newly designed welding equipment. According to thermal model of high power laser diode,numerical simulation is conducted theoretically on the module,and the result is consistent with the experiment of the heat dissipation of laser bar with the power of 60 W. From the experiment,the thermal resistance is 0.289 ℃/W when the refrigerant flow rate is 23 mL/min.