摘要

结温/热阻是反映激光器器件散热能力的综合参数，与封装焊料层的烧结质量关系密切。本文分别通过正向电压法和波长漂移法，测试计算得到激光器的工作结温，利用扫描声学显微镜分析了激光器焊料层中空洞分布；验证了结温测试方法的可行性，并确认了激光器结温与焊料层烧结质量之间的对应关系，相关结果将指导半导体激光器的研制改进和器件分筛。

Abstract

Junction temperature/thermal- resistance is reflected in the comprehensive cooling capacity of laser devices, which is closely related to the sintering quality of the solder layer. The operating junction temperatures of laser devices have been detected by the forward-voltage and wavelength-shift methods. The distribution of voids in the solder layer have been analyzed using a scanning acoustic microscope. The results verify the feasibility of junction temperature measurement, and confirm the relation between the junction temperature and the sintering quality of laser chips. These results will pave the way for the development of semiconductor lasers and the filtering of laser devices.

补充资料

中图分类号：TN248

DOI：10.3788/lop53.011404

所属栏目：激光器与激光光学

责任编辑：宋梅梅

基金项目：国家973 计划(2013CB632801)

收稿日期：2015-08-03

修改稿日期：2015-09-04

网络出版日期：2015-12-18

作者单位    点击查看

联系人作者：杨扬(yangyang.zju@163.com)

备注：杨扬(1987—)，男，博士后，主要从事大功率半导体激光器封装、失效分析和可靠性等方面的研究。

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引用该论文

Yang Yang,Yu Guolei,Li Peixu,Xia Wei,Xu Xiangang. Measurement and Analysis of Junction Temperature of Semiconductor Laser Devices[J]. Laser & Optoelectronics Progress, 2016, 53(1): 011404

杨扬,于果蕾,李沛旭,夏伟,徐现刚. 半导体激光器结温的测试及分析[J]. 激光与光电子学进展, 2016, 53(1): 011404