针对长线列红外时间延迟积分(TDI, Time Delay Intergration)探测系统面临通道多、噪声大、体积大、质量重、功耗大等问题，提出了利用专用集成电路(ASIC, Application Specific Integrated Circuit)方法解决长线列红外TDI探测读出电路中面临的问题。通过实现由一款全定制ASIC芯片(8路红外信号调理芯片)和红外TDI探测器构建的红外探测扫描成像系统验证ASIC芯片可以解决长线列红外TDI探测系统中所面临的上述问题，整个系统噪声为1.42 mV，功耗为0.72 W。实现了读出电路的高集成化，减少设计复杂度和工作量，为微型化、小型化航天遥感卫星研发提供技术支持和实践基础。

There always exist some challenges in long array column infrared Time Delay Integration(TDI) detecting system, such as large number of channels, high noise and power dissipation. To solve those problems mentioned above, a new solution was proposed to improve the performance of infrared TDI detecting system with Application Specific Integrated Circuit(ASIC) chip(eight-channel signal conditioning chip). Meanwhile, it helped to light the weight and reduce the system volume. In the system, the noise and dissipation both reduced to half than before. The average noise of system was 1.42 mV with power of 0.73 W. More higher integration was achieved by Readout Integrated Circuit(ROIC), design complexity and workload were reduced. It provides technical support and practical foundation for micro miniaturization aerospace remote sensing satellite development.