为了满足环境温度的要求，快速、可靠的完成光纤陀螺组合的设计方案，对光纤陀螺组合进行热分析和热设计。建立光纤陀螺组合模型和有限元模型，设定要求的边界和约束条件，分析光纤陀螺组合内部关键元器件及组件在整个温度循环的温度及可靠性。最后通过热设计的方式，DSP的最高温度降低了10 ℃，DC/DC电源模块的最高温度由原来的90 ℃降到了70 ℃，所有关键元器件都工作在其额定温度范围内，光纤陀螺组合内部温度场的均匀性得到了改善，由原来的30 ℃降到了10 ℃，为设计方案的确定提供了依据。

In order to meet the requirements of environmental temperature, complete quickly and reliably the design scheme of FOG combination, the thermal design and analysis of FOG combination were carried out. The combination model and finite element model were established, the boundary conditions and constraints conditions were set, the temperature and the reliability of the key components and assemblies of the combination FOG were analyzed in entire temperature cycles. Finally, the maximum temperature of DSP was reduced by 10 ℃, the maximum temperature of DC/DC power modules was from the original 90 ℃ down to 70 ℃, the all critical components and assemblies were working within their rated temperature range through the way of thermal design, the uniformity of fiber optic gyroscope combination of internal temperature field was improved, from the original 30 ℃ down to 10 ℃, a basis was provided to determine the design of scheme.