发光学报, 2016, 37 (1): 94, 网络出版: 2016-03-22
纳米银焊膏封装大功率COB LED模块的性能研究
High Power COB LED Modules Attached by Nanosilver Paste
大功率LED COB封装 纳米银焊膏 光电性能 可靠性 high power LED COB packaging nanosilver paste photoelectricity property reliability
摘要
为提高大功率LED的散热能力, 采用具有更高熔点和更优良的导电导热性能的纳米银焊膏作为芯片粘结材料, 以Al2O3基陶瓷基板封装COB LED模块。同时以Sn/Ag3.0/Cu0.5和导电银胶两种粘结材料作为对比, 分别在27, 50, 80, 100, 120 ℃等环境温度中测试3种模块的光电性能来评估模块的热管理水平; 在100 ℃环境下进行加速老化实验, 评估3种LED模块的可靠性。测试结果表明, 纳米银焊膏封装的大功率LED模块光电性能优异, 且具有较强的长期可靠性。
Abstract
In order to improve the thermal performance of the high-power LED, the novel nanosilver paste with higher melting temperature and thermal/electrical conductivity was used as die-attach material, and Al2O3-based ceramic substrates were used to form a high-power LED chip-on-board (COB) architecture. To compare the effect of die attach material, high power COB LED modules were packaged by nanosilver paste, traditional Sn/Ag3.0/Cu0.5 solder and silver epoxy, respectively. The photoelectricity properties of three kinds of LEDs under various ambient temperatures from 27 to 120 ℃ were measured to evaluate their thermal management. The accelerated degradation testing under 100 ℃ was measured to evaluate the reliability. The test results show that the nanosilver paste is a very promising die-attach material for high power multi-chip modules packaging.
杨呈祥, 李欣, 孔亚飞, 梅云辉, 陆国权. 纳米银焊膏封装大功率COB LED模块的性能研究[J]. 发光学报, 2016, 37(1): 94. YANG Cheng-xiang, LI Xin, KONG Ya-fei, MEI Yun-hui, LU Guo-quan. High Power COB LED Modules Attached by Nanosilver Paste[J]. Chinese Journal of Luminescence, 2016, 37(1): 94.