散热是大功率LED封装的关键技术之一, 散热基板的选用直接影响到LED器件的使用性能与可靠性。文章详细介绍了LED封装基板的发展现状, 对比分析了树脂基板、金属基板、陶瓷基板、硅基板的结构特点与性能。最后预测了今后大功率LED基板的发展趋势及需要解决的问题。

Thermal management is one of key technologies of high-power LED packaging, and heat spreader will directly affect the performance and reliability of LED devices. In this work, the status and development of heat spreaders for LED packaging was introduced. Some heat spreaders including resin substrates, metal substrates, ceramic substrates and silicon substrates were compared in the structural characteristics, thermal conductivity and packaging applications. Moreover, the development trend and problems to be solved of packaging substrates for LED were pointed out.