为研究热容型大功率半导体激光器在低环境温度、高瞬时功率、长工作间歇时间条件下的应用，建立三维瞬态热传导模型，通过有限元法计算得出热沉三维尺寸对半导体激光器瞬态热特性的影响。选取尺寸为26.6 mm×11.5 mm×4 mm的热沉进行热容型半导体激光器的封装测试，获得其在-20 ℃和-30 ℃环境温度下连续工作3.5 s过程中有源区温度随时间的变化曲线，并与数值计算的结果进行对比。结果表明，两者在误差范围内能够很好地吻合。

To investigate the application of heat capacity high power diode lasers under the condition of low temperature, high transient power and long interval working time, a 3-D transient thermal model was established. By adopting the finite element analysis, the effect of 3-D sizes of the heat sink on the transient thermal characteristics of diode laser was calculated successfully. According to the simulation results, the heat sink with dimension of 26.6 mm×11.5 mm×4 mm was chosen to package the heat capacity diode laser, and the experiments of the diode laser working 3.5 s continuously under -20 ℃ and -30 ℃ were carried out respectively. Eventually, the temperature curves of the active region were obtained and demonstrated a good consistence with the simulation results.