提出了包含三步式排泡过程的预烧结工艺以及双凹凼-凸台的微复合键合结构方案, 以便有效控制玻璃浆料层中的孔洞生成并精确控制键合间隙。预烧结工艺涉及的三步式排泡包含玻璃液形成、真空排泡与孔洞流平3个过程, 该过程有效地排除了气泡, 从而抑制了键合中间层中的孔洞形成, 其工艺的重复性和鲁棒性很强。微复合键合结构中的内外凹凼用于有效控制多余的熔融的玻璃浆料的流动路径, 避免其对封装结构的污染; 微阻挡凸台则可以精确地将玻璃浆料层的厚度即键合间隙控制到凸台高度。对键合性能的测试表明, 该方案简单有效, 键合强度和气密性良好, 键合间隙为10.1 μm, 键合强度为19.07 MPa, 键合漏率小于5×10-9 Pa·m3/s。

An innovated pre-sintering process including three-step bubble removing procedure and a micro composite bonding structure containing two micro grooves and one micro block bulge were investigated to effectively suppress the formation of voids in a glass frit layer and to precisely control the bonding gap. The three-step bubble removing procedure includes glass liquid forming, bubble removal in vacuum and void filling-up in air, which effectively removes the bubbles and suppress the generation of micro voids in the intermediate bonding layer. The innovated pre-sintering process shows good repeatability and robustness. The inside and outside micro grooves of the micro composite bonding structure were designed to effectively control the flowing path of the redundant molten glass frit to prevent the sealed micro structure from being polluted. And the micro block bulge was invented to make the thickness of the glass frit be precisely equal to the height of the bulge. The bonding performance testing result shows that the scheme is simple and feasible. Both bonding strength and hermeticity are good. The bonding gap is controlled to be 10.1 μm , the bonding strength is 19.07 MPa, and the leak rate is less than 5×10-9 Pa·m3/s.