红外焦平面器件广泛应用于**安全、空间探测、环境监测、工业控制等各个领域, 但是由于量少价高的特点, 可靠性成为其技术发展的主要瓶颈之一。盲元是红外焦平面的失效像元, 是对器件工作特性的反映, 因此, 可以用作可靠性评价和失效分析手段的重要参数。以出厂时间为界, 将盲元分为初始盲元和使用盲元, 并分析了其类型、性质、数量、位置及分布等方面的特征。根据红外焦平面器件结构特点, 从探测器、互联铟柱和读出电路三个方面分析了盲元形成原因, 全面探讨了盲元分析在研究器件损伤应力、失效位置、损伤机理上的应用, 以及准确评价器件性能和提高盲元剔除精度的可行性, 为器件结构的优化和工艺的改进提供了支撑。

The infrared focal plane arrays(IRFPA) have been applied in various areas, e.g. safety, space exploration, environmental monitoring, industry control. Due to the characteristics of small amount and high price, reliability has become a major bottleneck problem for IRFPAs′ development. As failure pixel, bad pixel is an objective reflection of IRFPA′s performance, so it is very suitable for failure analysis and reliability evaluation. Bad pixels were divided into initial bad pixels(IBPs) and used bad pixels(UBPs) by the boundary of delivery time, and their characteristics were analyzed such as type, nature, quantity, location and distribution et al. At the same time, according to hybrid IRFPAs′ structure, the cause of bad pixel was studied by three aspects: the detector chip, indium bump and ROIC. Meanwhile, the feasibility to study IRPFAs′ damage stress, failure position, damage mechanism and device evaluation were discussed all around. The research of bad pixel can be used to optimize the structure and process, and it also can improve the accuracy of bad pixel identification and replacements.