半导体激光器封装工艺过程对于激光器的输出特性、寿命等性能有重要影响,其中焊料的选择和焊接工艺是最关键的因素。采用半自动焊接系统将mini-bar芯片通过In焊料直接焊接在Cu热沉上,并通过硬件改进、软件优化、放缓成像过程等措施实现了高精度、高可靠性的焊接。通过对激光器的性能测试发现,其焊接功率稳定,焊接精度均值可达20 μm,“smile”效应值可以控制在0.5 μm。

Packaging technology for semiconductor laser diodes influences significantly on their output characteristics, such as lifetime. Selections of solders and welding process are very important. Using a semi-automatic welding system, mini-bar was directly welded on Cu heat sink with indium solder. By improving the welding system, optimizing software and slowing imaging procedures, the welding with high accuracy and high reliability was achieved. Measurements of the laser performances show that power for the welding is stable, its welded precision is 20 μm, “smile” effect can be controlled less than 0.5 μm.