从高功率LED理论模型分析着手, 分别从芯片级、封装级和系统级三个层面归纳和总结了LED热管理的最新研究进展。研究发现: 芯片倒装结构及合理的阵列方式有利于散热；性能优良的封装材料和翅片的优化能有效降低热阻；选择适当的二次散热方式也是提高散热效率的关键。

Theoretical model of high-power LED was analyzed in this paper, in which the latest research progress of its thermal management were studied and summarized from the chip level, package level and system level, respectively. It was found that flip-chip structure and reasonable placements were conducive to heat dissipation; the thermal resistance could be effectively reduced with excellent packaging materials and optimized fin size ; choosing the appropriate secondary heat dissipation way was also the key to improve the heat dissipation efficiency.