激光与光电子学进展, 2016, 53 (12): 120002, 网络出版: 2016-12-14
数据中心发射及接收集成芯片研究进展 
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Integrated Transmitter and Receiver Chips for Data Center
光学器件 硅光子 波分复用 阵列波导光栅 数据中心 optical devices silicon photonics wavelength division multiplexer arrayed waveguide grating data center
摘要
现阶段的光模块封装类型已从小型可插拔(SFP)系列逐渐向100 Gb/s可插拔(CFP)系列和4通道SFP(QSFP)系列过渡, 传输速率最高可达400 Gb/s, 发射端激光器消光比大于9 dB, 光波分复用器插入损耗小于1 dB, 发射功率大于0.3 dBm, 接收端探测器响应度为0.7 A/W, 接收灵敏度小于-17 dBm。阐述了在数据中心光互连中可以应用于IEEE制定的40/100 GbE标准802.3 ba的发射和接收集成芯片, 主要包括分立器件组装芯片、混合集成芯片和单片集成芯片, 介绍了其各种类型的基本结构和特性。
Abstract
At present the optical module package types have been changed gradually from small form-factor pluggable (SFP) series to centum form-factor pluggable (CFP) and quad SFP (QSFP) series. Transmission rate is up to 400 Gb/s. Transmitting lasers′extinction ratio (ER) is more than 9 dB. Optical wavelength division multiplexers′insert loss (IL) is less than 1 dB. Transmitting power is more than 0.3 dBm. Receiving detector′s responsivity is 0.7 A/W and receiving sensitivity is less than -17 dBm. Transmitting and receiving integrated chips in the data center, which can be applied on the 40/100 GbE, standardized as IEEE 802.3 ba, is demonstrated, including the discrete devices assembly chip, hybrid integration chip and monolithic integration chip, whose basic structures and characteristics are introduced as well.
李超懿, 安俊明, 张家顺, 王亮亮, 吴远大, 尹小杰, 王玥. 数据中心发射及接收集成芯片研究进展[J]. 激光与光电子学进展, 2016, 53(12): 120002. Li Chaoyi, An Junming, Zhang Jiashun, Wang Liangliang, Wu Yuanda, Yin Xiaojie, Wang Yue. Integrated Transmitter and Receiver Chips for Data Center[J]. Laser & Optoelectronics Progress, 2016, 53(12): 120002.
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