数值分析了大功率半导体激光器模块的散热特性及温度场, 以及焊料、热沉、导热胶和冷水板温度等参数对芯片内部最高温度的影响。结果表明, 焊料厚度小于 24μm 时, 其导热系数对芯片内部最高温度影响较弱, 无高阻层形成; 芯片内部最高温度随着热沉长或宽尺寸及导热系数的增大, 呈指数形式下降, 随着热沉厚度的增大呈对数形式升高; 当导热胶导热系数大于20W/(m·K)、厚度小于30μm时, 芯片温度趋于稳定; 冷水板温度与芯片内部最高温度呈比例系数为1的线性相关性。根据分析结果提出了激光器封装部件的尺寸、导热系数或材料的设计和选择原则。

The heat dissipation characteristics and the temperature field of high power semiconductoe laser module were studied through the numerical simulation analysis. The effects of the parameters of solder, heat sink, heat conduct glue and water-cooling plate temperature on the highest temperature of chip were analyzed. The results show that when the solder thickness is less than 24μm, the thermal conductivity of solder has less impact on the highest temperature of chip and no high resistance layer will be formed. The highest temperature of chip decreases in an exponential form with the increases of the length and width sizes and thermal conductivity of heat sink, while increases in an exponential form with the increases of the heat sink thickness. When the thermal conductivity of heat conduct glue is more than 20W/(m·K) and its thickness is less than 30μm, the temperature of chip becomes stable. The relationship between the water-cooling plate temperature and the highest temperature of chip shows linear correlation, and the proportional coefficient is equal to 1. According to the results, the design and selection principles of size, thermal conductivity or material of semiconductor laser packaging parts are proposed.