着重分析了晶圆表面残留颗粒对晶圆键合的影响, 并从表面残留颗粒统计意义的角度, 得到了一个晶圆键合的判定标准。为了改善键合界面出现的气泡问题, 一种基于点压技术的新型点压键合法被应用到整片键合中, 并和传统的金金热压键合法进行了比较。实验表明, 采用点压键合法能够有效抑制晶圆表面残留颗粒对晶圆键合的影响。

The effects of residual particles on wafer bonding were analyzed, and then, a bonding criterion was proposed in the view of particles statics. In order to solve the problem of bubbles generated by residual particles on the surface, a new wafer bonding method, called Spot Pressing Bonding, was applied to the bonding of wafers, and then it was compared with the conventional Au-Au thermocompression bonding. The experimental results suggest that bubbles on the bonding interface can be reduced significantly by Spot Pressing Bonding.