半导体光电, 2017, 38 (2): 212, 网络出版: 2017-05-09
基于ANSYS仿真的阳极键合薄膜形变量的研究
Study of Film Deformation about Anodic Bonding Based on ANSYS Simulation
阳极键合 残余热应力 有限元分析 麦夸特算法 anode bonding residual thermal stress finite element analysis LevenbergMarquardt algorithm
摘要
阐述了一种利用阳极键合技术加工的光纤法布里珀罗MEMS压力传感器的工作原理,建立了考虑阳极键合产生的热应力作用下边界固支的圆膜受外加压力的薄膜形变量公式。利用有限元分析软件ANSYS对与玻璃环键合后实际结构中的膜片在压力作用下的挠度变化进行模拟,采用麦夸特(LevenbergMarquardt)算法对模拟结果进行拟合修正,曲线拟合度达99.99%,得到了键合后实际结构中硅膜在外加压力作用下的形变量拟合公式。修正公式的曲线与实际ANSYS模拟所得数据拟合曲线的误差小于0.01%。该研究对膜片型光纤压力传感器的结构参数设计和广泛应用具有重要的理论指导意义。
Abstract
The working principle of an optical MEMS FabryPerot pressure sensor produced by anode bonding technology is introduced. A circular membrane deflection formula is established, which derive from the ideal boundary situation considering the residual thermal stress caused by anode bonding. ANSYS, a finite element analysis software, is used to simulate the changes of silicon membrane deflection in the actual structure. The deflection formula is fitted by LevenbergMarquardt algorithm and its determination coefficient is as high as 99.99%. Then, the revised deflection formula is applicable to actual structure after bonding. The error of the fitting curve of the modified formula is less than 0.01% for the data obtained from the ANSYS simulation. This study has important theoretical guiding significance for the structural parameters design and wide application of the diaphragmtype optical fiber pressure sensor.
葛益娴, 彭波, 张鹏, 赵伟绩. 基于ANSYS仿真的阳极键合薄膜形变量的研究[J]. 半导体光电, 2017, 38(2): 212. GE Yixian, PENG Bo, ZHANG Peng, ZHAO Weiji. Study of Film Deformation about Anodic Bonding Based on ANSYS Simulation[J]. Semiconductor Optoelectronics, 2017, 38(2): 212.