随着半导体激光自身输出功率和转换效率的提升, 半导体激光已经广泛的应用于激光加工领域。本文针对目前激光加工领域对半导体激光硬化光源的需求, 研制了波长为976 nm的连续输出半导体激光硬化光源。该光源采用空间/偏振合束工艺达到了较高的合束效率, 采用柱面微透镜阵列分割与聚焦镜复合较好地匀化了巴条激光器慢轴方向固有的光强起伏, 使聚焦光斑的光强呈平顶分布。最后对该光源进行了实验装调和测试。结果表明, 在工作电流为93 A时, 光源的最大输出功率为5 120W, 电光转换效率达47%, 光斑尺寸为2 mm×16 mm, 光斑分布为平顶分布, 平整度大于90%, 满足工业中对大面积、高效率激光硬化的要求。

With the improvement of self output power and conversion efficiency, semiconductor lasers have been widely used in laser processing field. Aiming at current requirement for hardening light source of semiconductor laser in laser processing field, a continuous output hardening light source of semiconductor laser with a wavelength of 976 mm was developed. The light source reached higher beam combination efficiency by adopting space / polarization beam combination technique, and better homogenized inherent light intensity fluctuation along slow axis for laser bar by adopting array division of cylindrical micro lens combined with focusing lens, thus making light intensity of focus spots flatly distributed. Finally, the light source was adjusted and tested experimentally. The results show that when the working current is 93 A, the maximum output power of the light source is 5 120 W, the electro-optical conversion efficiency reaches 47%, the spot size is 2 mm×16 mm and the flatness of the spot distribution is over 90%, which meet the requirement for large-scale high efficiency laser hardening in industry.