发光学报, 2017, 38 (7): 891, 网络出版: 2017-07-05
C-mount封装激光器热特性分析与热沉结构优化研究
Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure
摘要
为了降低单管半导体激光器的结温、提高器件的散热效果, 基于C-mount热沉的热特性分析提出了一种优化的台阶热沉结构, 研究了单管激光器结温和腔面侧向温度分布曲线的影响。在热沉温度298 K和连续输出功率10 W的条件下, 腔长为1.5 mm的典型C-mount封装结构激光器的结温为343.6 K, 热阻为4.6 K/W。通过在典型C-mount热沉中引入台阶结构, 使封装激光器的结温降低为333.8 K, 热阻减小到3.5 K/W。计算表明, 其输出功率可提高近20%。
Abstract
In order to reduce single-tube laser diode junction temperature and improve heat dissipation effects of the device, an optimized step sink structure was come up based on the thermal characteristic analysis of C-mount heat sink. The distribution of junction temperature and the lateral temperature of single-tube lasers were investigated. Under the conditions of the heat sink temperature of 298 K and continuous output power of 10 W, the junction temperature of typical C-mount heat sink package structure with 1.5 mm cavity length and 3 μm solder thickness is 343.6 K, and the thermal resistance is 4.6 K/W. By introducing level heat sink structure, the junction temperature of single-tube laser diode is 333.8 K and thermal resistance is 3.5 K/W. Theoretical calculation shows that the output power can be improved nearly 20%.
张晓磊, 薄报学, 张哲铭, 顾华欣, 刘力宁, 徐雨萌, 乔忠良, 高欣. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017, 38(7): 891. ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming, GU Hua-xin, LIU Li-ning, XU Yu-meng, QIAO Zhong-liang, GAO Xin. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017, 38(7): 891.