光子晶体光纤端面研磨过程中存在着大量磨粒切削光纤包层的空气孔壁。将这一过程简化为单颗磨粒切削单孔壁, 并应用有限元法(FEM)建立了数值仿真模型。分析了裂纹损伤产生的机理, 以及不同切削深度和磨粒尖端半径对加工结果的影响。仿真结果表明: 切削过程中, 孔壁边缘容易出现沿圆周分布的崩塌区域; 切削力和边缘崩塌区域随切削深度和磨粒尖端半径的增加而增加; 该光子晶体光纤孔壁边缘无崩塌的最大切削深度约为20nm。该方法对光子晶体光纤端面加工及耦合应用的研究具有重要意义。

In the end face lapping process of photonic crystal fiber, there are many grits cutting narrow walls between the photonic crystal fiber (PCF) air holes. This process is simplified as a single grit cutting single hole wall and finite element method (FEM) is used to establish the numerical simulation model. The formation mechanism of cracks and the influence of different cutting depths and grit tip radii on the processing results are analyzed. The simulation results show that in the cutting process, the edge of hole wall is prone to the collapse area which is distributed along the circumference; the cutting force and collapse area increase with the cutting depth and grit tip radius; for no collapse area generation, the maximum cutting depth of this PCF is about 20nm. This method paves the way for studying end surface processing and coupling application of PCF.