首页 > 论文 > 光学学报 > 37卷 > 10期(pp:1023002--1)

铝/氧化铝复合基板封装的LED光源的光热特性

Optical and Thermal Performance of LED Light Source Packaged by Al/Al2O3 Composite Substrate

  • 摘要
  • 论文信息
  • 参考文献
  • 被引情况
  • PDF全文
分享:

摘要

为获得具有高出光效率、高导热性能的发光二极管(LED)封装基板, 采用直接敷铝(Al)工艺制备了铝/氧化铝(Al2O3)复合陶瓷基板并对其表面进行化学机械抛光处理。运用光学模拟软件Tracepro和热学模拟软件ANSYS对该陶瓷基板封装的LED光源的光学性能和热学性能进行了模拟计算, 并和传统氧化铝陶瓷基板封装的LED光源进行了对比分析, 最后将所制备的铝/氧化铝陶瓷基板封装成板上芯片直装(COB)型LED光源进行测试。模拟和实验测试结果均表明:直接敷铝工艺制备的铝/氧化铝陶瓷基板热传递速度更快, 导热性能更加优异, 更适合用于大功率LED光源的封装; 铝/氧化铝陶瓷基板封装的的LED光源比基于传统氧化铝陶瓷基板的LED光源的光通量大, 出光效率更高。

Abstract

To obtain light emitting diode (LED)-packaged substrate with high luminous efficiency and high thermal conductivity, the direct aluminum (Al) plating technology is used to prepare aluminum/aluminum oxide (Al2O3) composite ceramic substrate whose surface is also polished by chemical-mechanical method. The optical and thermal performance of the LED light source packaged by this composite substrate are simulated by using the optical simulation software Tracepro and the thermal simulation software ANSYS. This LED light source is also compared with the traditional alumina ceramic substrate package LED light source. Finally, the prepared aluminum/alumina ceramic substrate is packaged into an on-board chip-mounted (COB) type LED light source for testing. Both results of simulation and experimental tests show that the aluminum/alumina ceramic substrate prepared by direct aluminum process has faster heat transfer rate, better thermal conductivity and it is more suitable for high power LED light source packaging. LED packaged by Al/Al2O3 ceramic substrate has bigger luminous flux and higher luminous efficiency, compared with the light source packaged by traditional Al2O3 ceramic substrate.

投稿润色
补充资料

中图分类号:TN312+.8;TN383.1

DOI:10.3788/aos201737.1023002

所属栏目:光学器件

基金项目:江苏高校优势学科建设工程

收稿日期:2017-05-02

修改稿日期:2017-06-06

网络出版日期:--

作者单位    点击查看

朱海涛:南京航空航天大学材料科学与技术学院, 江苏 南京 210000
傅仁利:南京航空航天大学材料科学与技术学院, 江苏 南京 210000
费 盟:南京航空航天大学材料科学与技术学院, 江苏 南京 210000
王彩霞:南京航空航天大学材料科学与技术学院, 江苏 南京 210000
季 磊:南京航空航天大学材料科学与技术学院, 江苏 南京 210000

联系人作者:朱海涛(zht771493640@163.com)

备注:朱海涛(1993-), 男, 硕士研究生, 主要从事LED封装热学和光学仿真计算模拟方面的研究。

【1】Wang Qing. Study on aluminum core printed circuit board applying in high power LED packaging[D]. Hangzhou: Zhejiang University, 2011.
王庆. 大功率LED散热封装用铝基印刷电路板研究[D]. 杭州: 浙江大学, 2011.

【2】Tian Minbo. Electronic packaging technology[M]. Beijing: Tsinghua University Press, 2003.
田民波. 电子封装工程[M]. 北京: 清华大学出版社, 2003.

【3】Fu X Y, Liu X J, Wu Y. Research and analysis of the design development and perspective technology for LED lighting products[C]. IEEE, International Conference on Computer-Aided Industrial Design & Conceptual Design, 2009: 1330-1334.

【4】Liang Wenyue, Li Yuanxing, Long Yongbing, et al. Design of freeform surface lens with chip on board LED sources for uniform illumination[J]. Laser & Optoelectronics Progress, 2017, 54(1): 012202.
梁文跃, 李远兴, 龙拥兵, 等. 板上芯片型LED光源均匀照明自由曲面透镜设计[J]. 激光与光电子学进展, 2017, 54(1): 012202.

【5】Pimputkar S, Speck J S, Denbaars S P, et al. Prospects for LED lighting[J]. Nature Photonics, 2009, 3(4): 180-182.

【6】Fang Jun, Hua Gang, Fu Renli, et al. Structure and substrate for high power white LED package[J]. Semiconductor Technology, 2013, 38(2): 67-74.
方军, 花刚, 傅仁利, 等. 大功率白光LED封装结构和封装基板[J]. 半导体技术, 2013, 38(2): 67-74.

【7】Sun Haojie, Li Baicheng, Zhang Dawei, et al. Parameters analysis of a new type of white-light LED package structure[J]. Acta Optica Sinica, 2009, 29(s2): 356-358.
孙浩杰, 李柏承, 张大伟, 等. 新型白光LED封装结构的参数分析[J]. 光学学报, 2009, 29(s2): 356-358.

【8】Liu Chao, Fu Renli, Gu Xiguang, et al. Structure of chip scale package for LED light source and its thermal performance analysis based on numerical simulation[J]. Laser & Optoelectronics Progress, 2016, 53(12): 122301.
刘超, 傅仁利, 顾席光, 等. 芯片级LED封装光源结构散热性能的数值模拟[J]. 激光与光电子学进展, 2016, 53(12): 122301.

【9】Wu Chaohui, Cheng Hao, Zhang Jun, et al. Technologies and development status of heat spreader for high-power LED packaging[J]. 2016, 37(1): 1-6.
吴朝晖, 程浩, 章军, 等. 大功率LED封装基板技术与发展现状[J]. 半导体光电, 2016, 37(1): 1-6.

【10】Qian Fei, Fu Renli, Zhang Pengfei, et al. Influence of ceramic substrate and soldering join technology on thermal dissipation performance of LED[J]. Electronic Components & Materials, 2014, 33(2): 47-51.
钱斐, 傅仁利, 张鹏飞,等. 陶瓷基板及钎焊技术对LED散热性能的影响[J]. 电子元件与材料, 2014, 33(2): 47-51.

【11】Kim S H, Singh S, Oh S K, et al. Visible flip-chip light-emitting diodes on flexible ceramic substrate with improved thermal management[J]. IEEE Electron Device Letters, 2016, 37(5): 615-517.

【12】Ouyang Xueqiong, Wang Shuangxi, Zheng Qiongna, et al. Development of package substrates for high power LED[J]. Electronics and Packaging, 2011, 11(4): 1-5.
欧阳雪琼, 王双喜, 郑琼娜, 等. 大功率LED用封装基板研究进展[J]. 电子与封装, 2011, 11(4): 1-5.

【13】He H, Fu R L, Wang D L, et al. A new method for preparation of direct bonding copper substrate on Al2O3[J]. Materials Letters, 2007, 61(19/20): 4131-4133.

【14】Zhang P F, Fang J, Fu R L, et al. Bonding of Al to Al2O3, via Al-Cu eutectic method[J]. Materials & Design, 2015, 87: 619-624.

【15】Zhang P F, Fu R L, Tang Y, et al. Morphology of thick film metallization on aluminum nitride ceramics and composition of interface layer[J]. Ceramics International, 2015, 41(10): 13381-13388.

引用该论文

Zhu Haitao,Fu Renli,Fei Meng,Wang Caixia,Ji Lei. Optical and Thermal Performance of LED Light Source Packaged by Al/Al2O3 Composite Substrate[J]. Acta Optica Sinica, 2017, 37(10): 1023002

朱海涛,傅仁利,费 盟,王彩霞,季 磊. 铝/氧化铝复合基板封装的LED光源的光热特性[J]. 光学学报, 2017, 37(10): 1023002

您的浏览器不支持PDF插件,请使用最新的(Chrome/Fire Fox等)浏览器.或者您还可以点击此处下载该论文PDF