作为半导体生产 中的一种重要设备, 快速退火炉需要实现精确、可靠的温度控制。 它通常使用辐射式高温计来检测温度。在使用过程中, 由于诸 多原因, 需要对高温计进行校温。基于某型进口快速退火 炉, 分析了其高温计的校温方法。介绍了热电偶和熔点测 试采样方法, 并采用这两种方法丰富了采样数据。通过 线性计算估算了1000 ～ 1500℃范围内的校温数据; 基于曲线 拟合进行了数据采样, 得到了更加准确的校温结果。通过比 较, 分析了两种校温方法各自的优缺点。结果表明, 线性计算校温法更适 用于1100℃以下的校温; 曲线拟合校温法更适用于1100℃以 上的校温。

As an important equipment for semiconductor production, Rapid Thermal Annealing (RTA) needs precise and reliable temperature control. Usually, it uses a pyrometer to measure its temperature. In the use of the pyrometer, because of many reasons, the temperature of the pyrometer should be calibrated. On the basis of a certain imported rapid thermal annealing furnace, the temperature calibration method of its pyrometer is analyzed. Both thermocouple and melting-point sampling methods are presented and are used to enrich the sampling data for temperature calibration. The temperature calibration data in the range from 1000℃ to 1500℃ are estimated by linear calculation. Through the data sampling based on curve fitting, more accurate temperature calibration results are obtained. The advantages and disadvantages of both temperature calibration methods are analyzed by comparison. The result shows that the linear calculation temperature calibration method is more suitable for the temperature calibration below 1100℃ and the curve fitting temperature calibration method is more suitable for the temperature calibration above 1100℃.