为了增强发光二极管(LED)散热器的散热能力并降低其质量,对传统LED太阳花散热器进行了开缝交错设计。利用Solidworks软件建立散热器三维模型,通过其插件Flow Simulation进行热仿真。以传统太阳花散热器为基础模型,通过实验得到此模型4个监测点的实际温度与仿真所得温度的平均误差为4.6%,在允许范围内,证实了仿真步骤的正确性。以此为基础,对不同开缝数量和开缝宽度对LED芯片最高温度的影响进行了研究,结果表明开缝交错设计明显增强了LED散热器的对流散热性能。当输入功率为26 W、开缝数量为9、开缝宽度为1 mm时,LED芯片的最高温度为122.15 ℃。在模型参数相同的条件下,配备开缝交错设计散热器的LED的最高温度比配备传统太阳花散热器的LED下降了8.68 ℃,且散热器质量下降了6.85 g。在自然对流条件下,开缝交错设计有效地延缓了热边界层的形成,改善了流场分布,增强了太阳花散热器的散热性能,并降低了其质量。

In order to enhance the cooling capacity of the light emitting diode (LED) radiator and reduce the weight of it, a slotted and staggered design is incorporated into the traditional LED sunflower radiator. The three-dimensional model of radiator is built by Solidworks software, and thermal simulation is carried out by Flow Simulation, which is the plug of Solidworks. Using the traditional sunflower radiator as a basic model, the average error between the actual temperature of the four monitoring points and the simulated temperature is 4.6%, which is within the allowable range. This result confirms the correctness of the simulation steps. Then, the influences of number and length of seams on the highest temperature of LED chip are studied, and the results show that the slotted and staggered design effectively enhances the convection cooling performance of the LED radiator. The highest temperature of the LED chip is 122.15 ℃ while the input power is 26 W, the number of seams is 9 and the length of seams is 1 mm. Under the same set of model parameters, the highest temperature of the LED with slotted and staggered radiator is reduced by 8.68 ℃ compared to the one with traditional sunflower radiator, and the weight of radiator is also reduced by 6.85 g. The slotted and staggered design is in favor of delaying the forming of thermal boundary layer and improving distribution of flow field, which enhances the cooling capacity and reduces the weight of sunflower radiator under the nature convection conditions.