红外与激光工程, 2018, 47 (1): 0105002, 网络出版: 2018-01-30   

半导体激光器双波长光纤耦合模块的ZEMAX设计

Design of double wavelengths fiber coupled module of semiconductor diode laser by ZEMAX
作者单位
1 中国科学院半导体研究所 光电子器件国家工程研究中心, 北京 100083
2 中国科学院大学, 北京 100049
摘要
为了发挥单管半导体激光器的优势, 获得光纤耦合模块多波长、高功率、高亮度的光束输出, 利用ZEMAX软件仿真模拟, 设计了一种单管光纤耦合模块。此模块将32支输出波长分别为915 nm、975 nm, 输出功率为15 W的单管半导体激光器, 经过微透镜组快慢轴光束整形、空间合束、偏振合束、波长合束以及光束聚焦等一系列工艺后, 耦合进芯径200 μm、数值孔径0.22的光纤。模拟结果显示, 光纤输出功率467.46 W, 光纤前后耦合效率大于98.47%, 总耦合效率高于97.39%, 光功率密度高于12.86 MW/(cm2·sr), 达到了泵浦激光器和功率型器件的性能要求。使用Solidworks软件设计了相应的底板结构, 并结合ANSYS软件进行散热模拟分析, 结果显示该模块散热性能良好, 可行性较高。
Abstract
In order to make full use of the advantages of single emitter semiconductor diode laser and obtain a light beam of more wavelengths, higher power, higher optical power density, a fiber coupled diode laser module was designed, which consisted of 32 single emitter semiconductor diode lasers using incoherent multiplexing by ZEMAX. The wavelengths of semiconductor diode laser were 975 nm and 915 nm, the power was 15 W. After the simulation of fast axis collimation, slow axis collimation, spatial multiplexing, polarization multiplexing, wavelength multiplexing, focusing and fiber coupling, this module can produce 467.46 W from a standard optical fiber with core diameter of 200 μm and numerical aperture(NA) of 0.22. The coupling efficiency before-after fiber was above 98.47%, the total coupling efficiency was above 97.39%. The optical power density was above 12.86 MW/(cm2·sr), module can be used as pump laser and high power device. The corresponding packaging structure was designed by Solidworks and its thermal performance was simulated by ANSYS. The final result demonstrates that this module plays a great heat dissipation performance and is of high feasibility.

刘翠翠, 王翠鸾, 王鑫, 倪羽茜, 吴霞, 刘素平, 马骁宇. 半导体激光器双波长光纤耦合模块的ZEMAX设计[J]. 红外与激光工程, 2018, 47(1): 0105002. Liu Cuicui, Wang Cuiluan, Wang Xin, Ni Yuxi, Wu Xia, Liu Suping, Ma Xiaoyu. Design of double wavelengths fiber coupled module of semiconductor diode laser by ZEMAX[J]. Infrared and Laser Engineering, 2018, 47(1): 0105002.

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