激光与光电子学进展, 2018, 55 (3): 031404, 网络出版: 2018-09-10
双相钢激光胶接点焊及接头强度分析 下载: 968次
Laser Spot Weld Bonding and Joint Strength Analysis of Dual-Phase Steels
激光技术 激光胶焊 超声C扫描图像 正交试验 双相钢 断口形貌 laser technique laser weld bonding ultrasonic C-scan image orthogonal tests dual-phase steel fracture morphology
摘要
以1.5 mm厚的DP590双相钢为母材,将焊接时间、焊接功率、离焦量作为变量,进行了激光胶接点焊正交试验。研究了接头内部形貌特征,分析了焊接参数对接头静力学性能的影响规律,并观察了接头拉剪断口形貌。结果表明,当焊接功率为1800 W、焊接时间为1000 ms、离焦量为-3 mm时,胶接点焊接头的平均峰值载荷最大,为7529.30 N;激光胶焊接头的超声C扫描图像可划分为焊核区、空腔区、热影响区和胶层区,且利用超声C扫图像能有效测量焊核直径;焊接功率对接头的拉剪性能影响最大,焊接时间次之,离焦量最小;不同焊接参数下的接头失效模式均为界面断裂,焊点的断口上分布着拉长韧窝。
Abstract
The orthogonal experiment of laser spot welding is conducted when the DP590 dual phase steel with 1.5 mm thickness is used as the base material and the welding time, the welding power and the defocusing are taken as variables. The internal morphology of the joints is studied, influences of welding parameters on the static performance of the joint are analyzed, and the morphologies of tensile shear fractures are invesitgated. The results show that, when the welding power is 1800 W, the welding time is 1000 ms and the defocusing is -3 mm, the average peak load of adhesively bonded spot welding joints is the maximal, which is 7529.30 N. The ultrasonic C-scan image of the laser welding joints can be divided into the nugget zone, the cavity zone, the heat-affected zone and the adhesive zone, and the ultrasonic C-scan image can be used to effectively measure the nugget diameter. The influence of the welding power on the tensile and shear properties of the joints is the maximal, that of the welding time is the second, and that of the defocusing is the minimal. With different welding parameters, the failure modes of the joints are interfacial fractures, and the elongated dimples are distributed on the fracture surface of solder joints.
冯煜阳, 曾凯, 何晓聪, 孙鑫宇, 韦涛. 双相钢激光胶接点焊及接头强度分析[J]. 激光与光电子学进展, 2018, 55(3): 031404. Yuyang Feng, Kai Zeng, Xiaocong He, Xinyu Sun, Tao Wei. Laser Spot Weld Bonding and Joint Strength Analysis of Dual-Phase Steels[J]. Laser & Optoelectronics Progress, 2018, 55(3): 031404.