激光与光电子学进展, 2018, 55 (4): 042301, 网络出版: 2018-09-11   

一维磁光光子晶体多通道非互易传输特性研究 下载: 1055次

Study on Multiple Channel Non-Reciprocal Transmission Characteristics of One-Dimensional Magneto-Optical Photonic Crystal
作者单位
江苏大学机械工程学院, 江苏 镇江 212013
摘要
构建了一种介质层与磁性层交替排列的一维磁光光子晶体,结构中间缺陷层采用介质材料。在缺陷层两侧分别施加方向相反的磁场,该结构能实现电磁波的非互易性传输。运用修正后的传输矩阵法计算分析结构的透射谱,研究结果表明,当缺陷层的厚度变化时,在一定的波长范围内,光子晶体光子禁带中会出现多个非互易通道,且缺陷层的厚度越大,相邻通道的间距越小,禁带中所能容纳的通道数目越多。当缺陷层厚度为7500 nm时,光子禁带中非互易通道数可达7。所设计的光子晶体结构有望用来制作多通道光隔离器,在密集波分复用光通信技术以及集成光路等领域得到应用。
Abstract
One-dimensional magneto-optical photonic crystals with a dielectric defect layer, which is composed of dielectric layers and magnetic layers alternately, is designed. Non-reciprocal transmission of electromagnetic wave can be achieved when the external magnetic field in opposite directions are applied to the magnetic layers existing at both sides of the defect layer. The transmission spectra of the structure are analyzed by using the modified transfer matrix method. The results show that when the thickness of the defect layer changes, multiple non-reciprocal channels will appear in the photonic crystal photonic band gap in a certain wavelength range. The larger of the thickness of the defect layer is, the smaller of the spacing between adjacent channels is, and the number of channels that can be accommodated in the forbidden band is greater. Seven non-reciprocal channels in the photonic band gap can be achieved when the thickness of the defect layer is 7500 nm. The proposed structure can be used to fabricate multi-channel optical isolators, and expected to be widely used in areas such as density wavelength division multiplexing optical communication technology and integrated optical circuit system.

王立松, 高永锋, 赵舒程, 何柳, 冯元会, 陈明阳, 周骏. 一维磁光光子晶体多通道非互易传输特性研究[J]. 激光与光电子学进展, 2018, 55(4): 042301. Lisong Wang, Yongfeng Gao, Shucheng Zhao, Liu He, Yuanhui Feng, Mingyang Chen, Jun Zhou. Study on Multiple Channel Non-Reciprocal Transmission Characteristics of One-Dimensional Magneto-Optical Photonic Crystal[J]. Laser & Optoelectronics Progress, 2018, 55(4): 042301.

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