为了实现低成本的精细电子线路快速成型, 以CuSO4和NaH2PO2混合溶液为活化液, 涂覆于基体表面形成活化层, 采用450nm蓝光激光对基体表面活化层进行扫描, 从而使基体活化, 并结合化学镀铜, 在激光扫描区域制备出了导电金属铜层。研究了CuSO4和NaH2PO2的质量浓度、扫描速率和涂覆次数对镀层成型效果的影响, 对活化后的基体进行了能谱分析, 通过扫描电镜对各阶段镀层相貌进行了表征, 并对镀层的结合性和导电性进行了检测。结果表明, 当CuSO4和NaH2PO2的质量浓度分别为10g/L和30g/L、扫描速率为320mm/s、涂覆次数为3次时, 镀层覆盖率为100%; 激光扫描后, 活化层中的Cu2+被还原为Cu微粒; 镀层线路微观结构均匀致密、轮廓清晰、边界整齐、结合性强, 表面电阻趋近于0Ω, 导电性良好。该工艺在一定程度上解决了激光诱导技术可操作性差以及贵金属涂布成本高的问题, 具有较高的实用价值, 在电子线路成型方面具有一定的应用前景。

In order to achieve rapid prototyping of fine electronic circuits at low cost, an activation layer was formed on the surface of the matrix by using the mixed solution of CuSO4 and NaH2PO2 as the activator. 450nm blue laser was used to scan the activation layer on the surface of the matrix and the matrix was activated. Combined with electroless copper plating, the conductive metal copper layer was prepared in the laser scanning region. The influence of mass concentration of CuSO4 and NaH2PO2, scanning rate and the number of coating on forming effect of the coating was studied. Energy spectrum analysis of the activated matrix was carried out. The appearance of the coating was characterized by scanning electron microscope. The bonding characteristics and the electrical conductivity of the coating were detected. The results show that coating coverage rate is 100% when mass concentration of CuSO4 and NaH2PO2 is 10g/L and 30g/L, the scanning speed is 320mm/s and coating number is 3. After laser scanning, Cu2+ in the activation layer is reduced to Cu particles. The microstructure of the coating line is uniform and compact with clear contour, neat boundary and strong adhesion. Surface resistance is close to 0Ω, and electrical conductivity is good. This process solves the problem of poor operability of laser induced technology and high cost of precious metal coating to a certain extent. The study has high practical value and has a certain application prospect in electronic circuit forming.