研究了1.06 μm连续激光辐照损伤CCD探测器的进程及不同损伤阶段CCD探测器成像能力的削弱程度。通过电子显微镜(SEM)扫描分析损伤机理, 结合损伤状态下的CCD图像, 解释了各损伤阶段成像质量变化的原因。结果表明：在点损伤阶段, 微透镜熔融汽化, 失去聚焦光束的能力, 使得进光量减少, 图像灰度降低, 同时汽化的微透镜冷却后附着在封装玻璃表面, 这是成像质量下降的主要原因; 在线损伤阶段, 激光对探测器多层结构有更深层次的损伤, 使得部分像元失去成像能力, 加上激光对封装玻璃的损伤, 使得CCD探测器的成像能力逐渐降低。以已有的评估方法为基础, 通过清晰度评定和形态学检测相结合的方式, 建立了损伤评估模型, 对不同损伤阶段的成像能力和成像质量进行评估, 获得了损伤时间、损伤形貌、损伤阶段和探测器成像能力的对应关系。

The damage proceeding of charge coupled device(CCD)detector irradiated by 1.06 μm continuous laser and the weakening of the imaging capability at different damage stages are studied. Combined with damage mechanism analyzed by scanning electron microscopy (SEM) and the CCD output images at the damage stages, the reasons of the imaging quality change at different damage stages are explained. Results show that during the point damage, the microlens melts, vaporizes and loses the ability of focusing beam, which cause the incoming laser to reduce and the image gray to decrease. Besides, the vaporized microlens is adhered to the surface of encapsulated glass after cooling. These are the main reasons for the image quality reduction. During the linear damage, the deeper damage of multilayer structure by laser causes part of pixels to lose imaging capability, while the encapsulation glass is damaged due to the irradiation. So the CCD imaging ability becomes weak gradually. Combining the image clarity with morphologic detection, we built the damage assessment model to evaluate the CCD imaging capability and imaging quality at different damage stages based on existing evaluation method. By this way, the corresponding relations between damage time, damage morphology, the damage stages and the CCD imaging capability are obtained.