光电子快报(英文版), 2017, 13 (1): 45, Published Online: Sep. 13, 2018  

Effects of etching conditions on surface morphology of periodic inverted trapezoidal patterned Si(100) substrate

Author Affiliations
State Key Laboratory of Solid State Lighting, Beijing Engineering Research Center for the 3rd Generation Semiconductor Materials and Application, Research and Development Center for Solid State Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Abstract
In this paper, the anisotropic etching process of Si(100) wafers in tetramethyl ammonium hydroxide (TMAH) solution with isopropyl alcohol (IPA) is investigated in detail. An inverted trapezoidal pattern is developed. A series of experiments are performed by changing TMAH concentration, IPA concentration, etching temperature and etching time. The structure of inverted trapezoidal patterns and roughness of the bottom surface are characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The results show that with TMAH concentration increases, the roughness of bottom surface will decrease. The addition of IPA into TMAH solution improves the morphology of the bottom surface significantly. Low temperature is beneficial to get a smooth bottom surface. Furthermore, etching time can change the bottom surface roughness. A model is proposed to explain the etching processes. The hillock area ratio of the bottom surface has the same tendency as the etching area ratio. Finally, smooth silicon inverted trapezoidal patterns are obtained for epitaxial growth of GaN-based light emitting diode (LED) devices.

ZHANG Lu, YUAN Guo-dong, WANG Qi, WANG Ke-chao, WU Ruiwei, LIU Zhi-qiang, LI Jin-min, WANG Jun-xi. Effects of etching conditions on surface morphology of periodic inverted trapezoidal patterned Si(100) substrate[J]. 光电子快报(英文版), 2017, 13(1): 45.

关于本站 Cookie 的使用提示

中国光学期刊网使用基于 cookie 的技术来更好地为您提供各项服务,点击此处了解我们的隐私策略。 如您需继续使用本网站,请您授权我们使用本地 cookie 来保存部分信息。
全站搜索
您最值得信赖的光电行业旗舰网络服务平台!