红外与激光工程, 2018, 47 (10): 1003002, 网络出版: 2018-11-25
中红外半导体激光器合束技术研究进展(特邀)
Development of beam combining technology in mid-infrared semiconductor lasers(invited)
摘要
中红外半导体激光器体积小、效率高, 在环境检测、空间通讯及****等领域具有重要的应用前景。但是中红外半导体激光器单元器件输出功率低, 限制了其在以上领域的应用。激光合束技术是能够实现中红外半导体激光器功率提升的重要途径。文中详细介绍了几种用于中红外半导体激光器的合束方法及中红外半导体激光器合束方面的最新进展。
Abstract
Mid-infrared semiconductor lasers possess the advantages of small volume and high efficiency and have important application prospects in the field of environmental detection, space communication and military defense. However, the output power of mid-infrared semiconductor laser device is low, which limits its application in the above fields. Laser beam combining technology is an important approach to enhance the power of mid-infrared semiconductor lasers. In this paper, several beam combining methods and the latest progress of mid-infrared semiconductor lasers were introduced in detail.
曹宇轩, 舒世立, 孙方圆, 赵宇飞, 佟存柱, 王立军. 中红外半导体激光器合束技术研究进展(特邀)[J]. 红外与激光工程, 2018, 47(10): 1003002. Cao Yuxuan, Shu Shili, Sun Fangyuan, Zhao Yufei, Tong Cunzhu, Wang Lijun. Development of beam combining technology in mid-infrared semiconductor lasers(invited)[J]. Infrared and Laser Engineering, 2018, 47(10): 1003002.