激光与光电子学进展, 2019, 56 (4): 041401, 网络出版: 2019-07-31  

基于新型子孔径形状的高占空比孔径填充阵列相干合成 下载: 1107次

Coherent Beam Combining Based on High Filling Factor Array with New Sub-Aperture Shape
作者单位
国防科技大学前沿交叉学科学院, 湖南 长沙 410073
摘要
提出了基于2种新型子孔径形状的填充方案,相较于传统圆形子孔径正六边形排列填充方案,所提方案能获得更高的面积填充占比。通过评估相干合成的远场光束质量,权衡光束截断导致的能量损耗与占空比改善带来的光束质量提升,计算得到最优解。仿真结果表明,相比于圆形子孔径正六边形排列填充方案,所提2种方案能将远场桶中功率占比分别提升9.2%和13.9%。所提孔径填充优化方案对提高光纤激光阵列分孔径相干合成效率具有一定的指导意义。
Abstract
Two filling schemes based on new sub-aperture shapes are proposed, which can achieve a higher area filling ratio than that for the filling scheme based on a hexagonal close-packed array with traditional circular sub-apertures. By the evaluation of the far-field beam quality and the balance between the energy loss caused by beam truncation and the beam quality improvement by filling factor improvement, an optimal solution is obtained. The simulation results show that these two new schemes can increase the proportion of power in the far field bucket by 9.2% and 13.9% comparing with those based on a hexagonal close-packed array with circular sub-apertures. The proposed aperture filling optimization schemes have some guidance value for increasing the efficiency of tiled-aperture coherent beam combining of fiber laser arrays.

奚加超, 支冬, 马阎星, 司磊. 基于新型子孔径形状的高占空比孔径填充阵列相干合成[J]. 激光与光电子学进展, 2019, 56(4): 041401. Jiachao Xi, Dong Zhi, Yanxing Ma, Lei Si. Coherent Beam Combining Based on High Filling Factor Array with New Sub-Aperture Shape[J]. Laser & Optoelectronics Progress, 2019, 56(4): 041401.

引用该论文: TXT   |   EndNote

相关论文

加载中...

关于本站 Cookie 的使用提示

中国光学期刊网使用基于 cookie 的技术来更好地为您提供各项服务,点击此处了解我们的隐私策略。 如您需继续使用本网站,请您授权我们使用本地 cookie 来保存部分信息。
全站搜索
您最值得信赖的光电行业旗舰网络服务平台!