红外技术, 2019, 41 (2): 134, 网络出版: 2019-03-23
热像仪光机热集成分析综述
Review of Thermal-structural-optical Integration Analysis of Thermal Imager
摘要
光机热集成分析不仅能够对红外成像系统在复杂环境下像质进行评价, 而且能够在设计阶段对热像仪模型进行优化设计, 从而节省研发时间, 提高研究效率。本文介绍了光机热集成分析的基本原理, 对该领域近年出现的光机热集成方法进行归纳总结与分析对比, 指出目前光机热集成分析存在的缺点与不足, 重点介绍了折射率梯度和光学胶对热像仪像质的影响, 并对热像仪集成分析发展趋势做出展望。
Abstract
Thermal–structural–optical(TSO) integrated analysis combines optical, mechanical, and thermal analyses and is essential for designing an optical mechanical system. It can be used to identify shortcomings in a design, reduce the time required for the research, and make it more efficient. This paper introduces the basic principle of TSO integrated analysis and summarizes its development. The paper focuses on the gradient index and glue modeling. Finally, development trend of TSO integrated analysis is investigated.
马宏川, 范宏波, 林宇, 王磊. 热像仪光机热集成分析综述[J]. 红外技术, 2019, 41(2): 134. MA Hongchuan, FAN Hongbo, LIN Yu, WANG Lei. Review of Thermal-structural-optical Integration Analysis of Thermal Imager[J]. Infrared Technology, 2019, 41(2): 134.