红外技术, 2019, 41 (2): 194, 网络出版: 2019-03-23  

基于近红外视觉的排渣机械手高温炉渣定位方法

High-temperature Furnace Slag Positioning Method for Slag Discharging Manipulator Based on Near-infrared Vision
作者单位
西安工业大学电子信息工程学院, 陕西西安 710021
摘要
针对金属冶炼排渣机械手对炉渣位置定位的问题, 本文提出了一种基于近红外视觉的高温目标定位方法。使用红外阵列传感器和 CMOS摄像头结构光三维重建视野标定后搭建出一套近红外视觉系统。用蜡烛光模拟高温炉渣, 将红外阵列传感器采集的温度点阵数据绘制出伪彩色温度分布图, 利用仿射不变性原理将其与彩色图像配准融合, 生成高温炉渣及其周围环境的红外 -可见光融合图像。最后, 利用红外阵列传感器横、纵视野角分量投影的方法得到高温炉渣的三维坐标。实验结果表明, 红外阵列传感器定位高温炉渣的方法是可行的。定位得到高温炉渣的三维坐标为机械手提供目标期望给定, 机械手可进一步完成排渣任务。
Abstract
A high-temperature target positioning method based on a near-infrared vision system is proposed for the slag positioning for the manipulator in metal smelting and slagging. A near-infrared vision system is built by infrared array sensors and a complementary metal–oxide–semiconductor(CMOS) camera after performing directional calibration of structured light three-dimensional reconstruction. Candle light is used to simulate the high-temperature slag, and the temperature lattice data collected by the infrared array sensor are plotted as a pseudocolor temperature distribution map. The affine invariance principle is used to align the pseudocolor temperature distribution map with the color image to generate an infrared–visible fusion image of the high-temperature slag and its surrounding environment. Finally, the three-dimensional coordinates of the high-temperature slag are obtained by the infrared array sensors’ transverse and longitudinal viewing angle proportion projection. The experimental results show that the method of positioning high-temperature slag by an infrared array sensor is viable. The three-dimensional coordinates of the high-temperature slag gained by positioning could provide an objective expectation for the manipulator, helping the manipulator to complete slagging.

冯帆, 辛大欣, 华瑾, 刘鹏. 基于近红外视觉的排渣机械手高温炉渣定位方法[J]. 红外技术, 2019, 41(2): 194. FENG Fan, XIN Daxin, HUA Jin, LIU Peng. High-temperature Furnace Slag Positioning Method for Slag Discharging Manipulator Based on Near-infrared Vision[J]. Infrared Technology, 2019, 41(2): 194.

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