这些年光子集成技术发展迅速, 引起广泛讨论, 被认为将会重现电子集成摩尔定律的飞速发展。光子集成是光电子器件增强功能、提高性能、减小尺寸、降低功耗、降低成本的根本技术方向。由于有源功能与无源功能之间在材料层面的不兼容性, 光子集成面临的主要技术挑战是实现无源和有源功能在同一芯片上的高质量、可扩展集成。讨论了光子集成的可扩展性的根本限制因素, 并针对不同应用, 讨论集成材料平台选择、无源与有源光子材料集成、器件加工、集成工艺、测试等关键步骤的一些关键技术问题。

Photonic integration is a key technology aimed at enhancement of functionality and performance as well as reduction of device size, power consumption and costs of optoelectronic components. Because of the incompatibility between active and passive functions at the materials level, the main technological challenge facing photonic integration is the realization of active-passive integration on the same substrate with high quality. This talk will discuss the fundamental limitations to the scalability of photonic integration, and will discuss key technical problems in choice of substrate materials, passive-active material integration, device fabrications and integration processing, and test.