皮秒激光精密加工金刚石等硬脆性材料是当前最佳工程解决方案与技术前沿热点。常规采用脉冲宽度≤20 ps激光光源, 可以实现切割面崩边＜5 μm, 表面粗糙度Ra1.6的切割质量。我们采用脉冲宽度200 ps的低成本皮秒光纤激光器, 对激光功率与切割速度等工艺参数进行优化, 通过外光路整形系统对光束进行整形, 以及聚焦透镜的优化设计等关键技术进行研发, 实现了切缝的最大崩边宽度≤6 μm、表面粗糙度Ra1.6的加工质量, 其加工效率与20 ps激光精密加工工艺一致, 生产成本显著降低, 满足了生产金刚石刀具精密切割需求, 可解决拉丝模、刀具刃口加工的后续抛光问题。

Picosecond laser precision processing of diamond and other hard brittle materials are currently the hot spot in the technology frontier and the best engineering solution. The cutting surface edge breakage <5 μm and the roughness of the cutting surface roughness Ra1.6 can be achieved by conventional laser light source with pulse width ≤20 ps.Now the low-cost picosecond fiber laser with a pulse width of 200 ps was used. Laser power, cutting speed and other process parameters were optimized. Beam shaping was done through an external optical path shaping system. And focus lens optimization design and other key technologies for research and development. The maximum edge breakage width ≤6μm and the processing quality of the surface roughness Ra1.6 were achieved . The processing efficiency was consistent with 20 ps laser precision processing technology. The production cost was significantly reduced. The need of precision cutting of diamond tools was met. And the follow-up polishing problem of drawing die and cutting edge machining can be solved.