以高机械灵敏度为设计目标, 对一种解耦硅MEMS陀螺进行了结构优化, 并利用有限元分析软件ANSYS对该MEMS陀螺进行了模态、应力、位移、抗过载及谐响应仿真分析, 确定并验证了高灵敏度MEMS陀螺的结构优化原则。优化后的硅MEMS陀螺驱动和检测模态谐振频率分别为3700与3718Hz, 机械灵敏度可达0.95nm/(°/s), 能够承受500g的冲击载荷, 并且能够实现驱动模态和检测模态解耦。

A decoupled silicon MEMS gyroscope was optimized to realize a high mechanical sensitivity, and its performance of modal, stress, displacement, overload resistance and harmonic response was analyzed and simulated by using the finite element analysis software ANSYS. The principles for structure optimization of the high-sensitivity MEMS gyro were confirmed and verified. The resonant frequencies of the optimized silicon MEMS gyro under driving and sensing modes are 3700 and 3718Hz, respectively, and the mechanical sensitivity is up to 0.95nm/(°/s). The gyro can endure the impact load of 500g and realize the decoupling of driving and sensing modes.