针对传统机械式切割钻石的加工过程中, 切削力四处传播容易造成钻石损坏, 切割的噪音和粉尘也很大, 加工精度不高等问题, 提出采用激光切割钻石的加工新方式。为了减少实验和加工过程中的盲目性, 分析了钻石激光切割的加工机理, 根据加工过程中温度场和热应力分布, 推导出材料加工阈值和裂纹产生阈值公式, 作为钻石切割的上下参考阈值。并且设计了一款基于软件的532 nm激光切割钻石装置, 装置中采用了具有切割、成像和照明三种功能的新型复合镜头, 保证加工装置不仅能切割钻石, 还能动态显示钻石加工效果; 设计的专用夹具可带动钻石自由旋转, 从而便于用户根据杂质情况任意选择加工位置, 提高加工质量, 减少加工中损耗, 从而实现最优加工。

In the process of traditional mechanical cutting diamond, the cutting force of spreading can easily cause the damage of the diamond, the cutting noise and dust of cutting is very big, the accuracy of processing is not high. A new processing method of laser diamond cutting is proposed. In order to reduce the blindness in the experiment and process, the mechanism of laser cutting diamond is analyzed. According to the distribution of temperature field and thermal stress during processing, the formula of material processing threshold and crack generation threshold was derived as the upper and lower reference threshold of diamond cutting. And a software-based 532 nm diamond laser processing device is designed. A new compound lens with functions of cutting and imaging and lighting is used in this device. The equipment can not only cut the diamond, but also show the diamond processing effect dynamically. The special fixture can drive the diamond to rotate freely, which makes it convenient for users to select the processing position according to the impurity. Significantly reduce weight-loss of diamond, so as to achieve optimal processing.