提出了一种通过制作面内微结构实现聚酰亚胺薄膜面内热导率及表面红外发射率调控的方法。通过建立简化的二维热传导模型，实现了对具有周期性微结构薄膜面内等效热导率的计算。以此为基础，研究了微结构接触面积比及填充因子对等效热导率及等效红外发射率的影响。理论计算表明，当微结构的接触面积比为0.18、填充因子为0.28时，薄膜面内等效热导率仅为材料本身热导率的18.8%。实验制备了两种具有不同接触面积比和填充因子的聚酰亚胺薄膜。薄膜直径65mm，厚度约为500nm。采用非接触式面内热导率测量法测得无微结构薄膜的面内热导率为0.164W/mK,接触面积比为0.20及0.46的微结构薄膜的面内热导率分别为0.041W/mK和0.091W/mK，而发射率分别为0.161和0.175。

A method of fabricating in-plane microstructures to control the in-plane thermal conductivity and the surface infrared emissivity of the polyimide film was proposed. By establishing a simplified two-dimensional heat transfer model, the equivalent in-plane thermal conductivity of a periodic microstructured film was calculated. The effects of the contact area ratio and the filling factor of the microstructures on the equivalent thermal conductivity and the equivalent infrared emissivity were studied. Theoretical calculations show that when the contact area ratio was 0.18 and the fill factor was 0.28, the equivalent in-plane thermal conductivity of the polyimide film was decreased to 18.8% compared to that of the material itself. Two polyimide film samples with different contact area ratios and fill factors were fabricated. The diameter and the thickness of both films were 65mm and 500nm, respectively. The in-plane thermal conductivity of the pure polyimide film measured by a non-contacted in-plane thermal conductivity measurement was 0.164W/mK, and the in-plane thermal conductivities of the microstructured polyimide film with contact area ratio of 0.20 and 0.46 were 0.041W/mK and 0.091W/mK, and the emissivity were 0.161 and 0.175, respectively.