应用激光, 2020, 40 (4): 757, 网络出版: 2020-12-28  

半导体激光封接OLED工艺研究

Research of the Sealing OLED Process by Diode Laser
作者单位
大族激光科技产业集团股份有限公司, 广东 深圳 518052
摘要
有机发光显示屏(Organic Light Emitting Display, 简称OLED)是一种具有诸多优点的显示器, 目前被广泛应用于电子设备中, 但其使用寿命极易受水汽及氧气的影响。采用激光封装能有效解决这一问题, 但玻璃焊接存在裂纹、气孔等缺陷。本文采用大族激光完全自主研发的WFD100焊接系统, 借助测温仪研究了激光功率对焊缝形貌及焊接过程中温度变化的影响。结果表明: 在合适的热输入工艺参数下, 能获得成型良好的接头形貌, 随着激光功率的增大, 接头出现裂纹缺陷。
Abstract
Organic Light Emitting Display (OLED) possesses many advantages and has been widely applied to electronic equipment, but its service life is easily limited by water vapor and oxygen. This problem can be effectively solved by laser encapsulation, but some defects would occur such as cracks and pores during the welding process. In this paper, own developed WFD100 welding system and thermo detector were used to study the influence of laser power on weld appearance, microstructure and temperature changes. The results indicated that visually sound welds could be produced with appropriate parameters of heat input and cracks formed with the increase of laser power.

李小婷, 朱宝华, 赵曙明. 半导体激光封接OLED工艺研究[J]. 应用激光, 2020, 40(4): 757. Li Xiaoting, Zhu Baohua, Zhao Shuming. Research of the Sealing OLED Process by Diode Laser[J]. APPLIED LASER, 2020, 40(4): 757.

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