应用激光, 2020, 40 (3): 483, 网络出版: 2021-01-09   

水辅助激光加工中射流流向对加工的影响研究

Study on the Influence of Flow Field on Water Jet Assisted Laser Processing
作者单位
桂林电子科技大学机电工程学院广西制造系统与先进制造技术重点实验室, 广西 桂林 541004
摘要
水辅助激光加工中, 水流状态对激光加工有重要影响。为了研究激光加工中不同水流状态对加工质量的影响, 文章建立带切槽的水射流冲击模型, 分析激光扫描方向与水流同向和反向对加工中流场造成的差异; 通过对比试验, 研究两种刻蚀方式对单晶硅切槽形貌和几何尺寸的影响, 并分析差异产生的机理。研究结果表明, 同向刻蚀模型中切槽截面中心上的总压强最小为2 941.970 Pa, 远大于反向刻蚀; 反向刻蚀模型在近壁面处的速度更大, 比同向刻蚀大3.104 m/s。反向刻蚀比同向刻蚀的槽宽小约13.500 μm且表面无熔渣堆积; 反向刻蚀槽深明显大于同向刻蚀, 并且此差距随激光功率增加而增加, 在激光功率15 W时最大相差127.773 μm; 反向刻蚀切槽上表面的平均面粗糙为0.158 μm, 更接近基材未加工区域的0.141 μm。模拟和实验的结果为进一步提高水射流辅助激光加工的切割质量提供了思路。
Abstract
The flow state has an important influence on laser processing in water-assisted laser processing. In order to study the influence of different flow conditions on the processing quality in laser processing, a water jet impact model with grooves is established in this study to analyze the difference between laser scanning direction and water flow direction and the effect of this direction on flow field in machining. The effects of two etching methods on the morphology and geometrical size of single crystal silicon grooves were studied through comparative experiments. The mechanism of the difference is analyzed. The results show that the minimum total pressure on the center of the notch section in the co-etching model is 2 941.970 Pa, which is much larger than that in the reverse etching model, and the velocity of the reverse etching model near the wall is larger than that in the co-etching model, which is 3.104 m/s larger than that in the co-etching model. The groove width of reverse etching is about 13.500 μm smaller than that of co-etching, and there is no slag accumulation on the surface; the groove depth of reverse etching is significantly larger than that of co-etching, and this gap increases with the increase of laser power, the maximum difference is 127.773 μm at 15 W laser power; the average surface roughness of reverse etching groove is 0.158 μm, which is closer to that of substrate without adding. The working area is 0.141 μm. The results of simulation and experiment provide ideas for further improving the cutting quality of water jet assisted laser processing.

焦辉, 杨林帆, 周嘉, 赵要武, 龙芋宏. 水辅助激光加工中射流流向对加工的影响研究[J]. 应用激光, 2020, 40(3): 483. Jiao Hui, Yang Linfan, Zhou Jia, Zhao Yaowu, Long Yuhong. Study on the Influence of Flow Field on Water Jet Assisted Laser Processing[J]. APPLIED LASER, 2020, 40(3): 483.

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