过去的几十年中，结构光照明在三维立体成像和计算机视觉有着重要的应用。然而，传统结构光产生系统结构复杂、体积庞大，这严重限制了它的潜在应用价值。提出了一种用于产生结构光的紧凑型的光电集成芯片，这种芯片基于绝缘体上的硅（SOI）材料。该方法具有结构简单、输出稳定、设计灵活等优势。不同于传统的结构光发生系统，该方法中，光束的强度及相位调制以及光束间的相互干涉都是由片上系统操控的。这有效避免了外界扰动对光斑质量的影响，同时提升了系统的便携性。实现了全片上调控的红外结构光产生系统。该结构光芯片大小仅为0.5×0.5 mm，可以产生约200×200 μm的结构光照明区域。芯片照明区域的大小和结构光的单元结构周期与光栅的结构设计和光源波长相关。此外，通过设计合理地设计芯片上的元件布局，我们可以得到多种不同结构的照明图样。

Structured illumination has been used for several decades in the field of three-dimensional （3D） shape measurement and machine vision. However, the bulky structured illumination generation system limits its potential in practical applications. In this paper, a compact design method based on the silicon-on-insulator （SOI） optoelectronic integrated chip is proposed. Compared with the traditional structured light generation methods, the chip-based illumination method is simple, stable and flexible. The beam modulation and interference are achieved by on-chip devices, which efficiently avoids external disturbance and increases the portability of system. This is the first time using only on-chip devices to control the infrared beam and generate structured light pattern. The chip can provide an illumination area of about 200*200 μm² with the chip size of 0.5*0.5 mm. The illumination area and structural period are related to the design of grating couplers and the wavelength of light. Moreover, different illumination patterns can be achieved by appropriately designing the optical devices on the chip.