Photonics Research, 2020, 8 (6): 06000912, Published Online: May. 19, 2020   

Design and fabrication of a SiN-Si dual-layer optical phased array chip Download: 1141次

Author Affiliations
1 Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
2 Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
3 Beijing R&D Institute, VanJee Technology, Beijing 100193, China
Abstract
A SiN-Si dual-layer optical phased array (OPA) chip is designed and fabricated. It combines the low loss of SiN with the excellent modulation performance of Si, which improves the performance of Si single-layer OPA. A novel optical antenna and an improved phase modulation method are also proposed, and a two-dimensional scanning range of 96°×14° is achieved, which makes the OPA chip more practical.

Pengfei Wang, Guangzhen Luo, Yang Xu, Yajie Li, Yanmei Su, Jianbin Ma, Ruiting Wang, Zhengxia Yang, Xuliang Zhou, Yejin Zhang, Jiaoqing Pan. Design and fabrication of a SiN-Si dual-layer optical phased array chip[J]. Photonics Research, 2020, 8(6): 06000912.

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