提出一种用于半导体芯片表面裂纹瞬时成像检测的线激光锁相热成像新技术。该技术系统由线扫描激光源、高速红外照相机及控制计算机组成,由线激光束扫描目标芯片表面并利用红外相机测量热波传播。提出新型无基线裂纹可视化算法,裂纹可导致热波阻挡现象,故被自动可视化和诊断,不依赖由目标芯片原始状态所获得的基线数据。对芯片在制造过程中产生细微裂纹进行研究,实验证明热成像新技术可对宽度为几十微米的裂纹进行可视化。

This paper proposes a new linear laser phase-locked thermal imaging technology for surface crack instantaneous imaging detection of semiconductor chips. The technical system consists of a linear scanning laser source, a high-speed infrared camera, and a control computer. The surface of the target chip is scanned by a linear laser beam and the thermal wave propagation is measured by an infrared camera. A new visualization algorithm without baseline crack is proposed. Because cracks can cause thermal wave blocking, they can be visualized and diagnosed automatically, which is independent of baseline data obtained from the original state of the target chip. The microcracks of the chips generated in the manufacturing process are studied. The experiments demonstrate that the visualization of cracks with a width of tens of micrometers can be realized by the laser phase-locked thermal imaging technology.