为了预测微透镜阵列玻璃模压成型过程中微结构的加工工艺参数,利用高级非线性有限元软件MSC.Marc进行微透镜阵列的有限元建模;将不同微结构宽度的阵列光学元件进行分组,利用有限元模型分别计算每组硫系阵列光学元件的微结构高度对等效米塞斯应力的影响,得到微结构宽度相同、高度不同的硫系玻璃微透镜阵列结构对模压成型后等效米塞斯应力的影响,对微结构宽度相同、高度不同的阵列光学元件的最大等效米塞斯应力进行数据拟合处理,得出各组等效米塞斯应力的趋势,获得适合模压的硫系玻璃Ge23Se67Sb10阵列光学元件的微结构高度与宽度之比。仿真结果表明:微结构高度越小,等效米塞斯应力越小;硫系玻璃微透镜阵列的等效米塞斯应力由中心到边缘逐渐增大,边缘处的等效米塞斯应力最大;当微结构高度与宽度之比大于0.322时,模压产生的等效米塞斯应力大幅增加。

In order to predict the microstructure process parameters of the microlens array glass during molding, a finite element analys is model of the microlens array is established using the advanced nonlinear finite element software MSC.Marc in this study. The array optical elements with different microstructural widths are divided into several groups. The influence of the microstructural height of each group of the chalcogenide array optical elements on the equivalent von Mises stress is calculated by the finite element analysis model; subsequently, we obtain the influences of chalcogenide glass microlens array structures with the same microstructural width and different microstructural heights on the equivalent von Mises stress after the molding. The maximum equivalent von Mises stress of array optical elements with the same microstructural width and different microstructural heights is fitted, and the trend of equivalent von Mises stress is analyzed to obtain the ratio of the microstructural height to the width of the chalcogenide glass Ge₂₃Se₆₇Sb₁₀ array optical elements suitable for molding. The simulation results show that the lower the microstructural height is, the lower the equivalent von Mises stress is. The equivalent von Mises stress of the chalcogenide glass microlens array increases gradually from the center to the edge and is the highest at the edge. When the ratio of the microstructural height to the width is greater than 0.322, the equivalent von Mises stress generated by the molding increases greatly.