光子学报, 2019, 48 (12): 1223003, 网络出版: 2020-03-17  

用于层间耦合的绝热光学倒锥工艺研究

Process Research of Optical Inverted Cone for Interlayer Coupling
作者单位
1 长春理工大学 理学院 高功率半导体激光国家重点实验室, 长春 130022
2 中国科学院苏州纳米技术与纳米仿生研究所, 江苏 苏州 215123
摘要
针对光学倒锥窄尖的制备工艺困难的问题,通过特殊设计掩膜版,利用步进式光刻机,经过一次步进,对光刻胶进行两次连续的图案化处理,突破紫外光刻机的分辨率极限,制备出尖端接近50 nm的倒锥结构图案.再对光刻胶进行回流处理,解决其分层的问题,保证了结构侧壁的光滑度及尖端的完整性.在深硅刻蚀工艺中,通过对刻蚀中各气体组分进行调整,改善了锥形结构表面形貌,使结构的均匀性和完整性得到提升.最终得到了适用于层间耦合的尖端接近50 nm的光学倒锥.
Abstract
Aiming at the difficulty in the preparation process of the optical inverted cone narrow tip, through a special design mask, the photoresist was subjected to two consecutive patterning processes by one stepping using a stepper. Breaking through the resolution limit of the UV lithography machine, an inverted cone structure pattern with a tip close to 50 nm was prepared.The photoresist was reflowed to solve the problem of layering, which ensures the smoothness of the sidewall of the structure and the integrity of the tip. In the deep silicon etching process, by adjusting the gas components in the etching, the surface morphology of the tapered structure is improved, and the uniformity and integrity of the structure are improved. Finally, an optical inverted cone with a tip close to 50 nm suitable for interlayer coupling is obtained.

刘俊成, 孙天玉, 贾慧民, 王筱, 唐吉龙, 房丹, 方铉, 王登魁, 张宝顺, 魏志鹏. 用于层间耦合的绝热光学倒锥工艺研究[J]. 光子学报, 2019, 48(12): 1223003. Jun-cheng LIU, Tian-yu SUN, Hui-min JIA, Xiao WANG, Ji-long TANG, Dan FANG, Xuan FANG, Deng-kui WANG, Bao-shun ZHANG, Zhi-peng WEI. Process Research of Optical Inverted Cone for Interlayer Coupling[J]. ACTA PHOTONICA SINICA, 2019, 48(12): 1223003.

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